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Journal Articles

Effect of Zinc Content on the Microstructure, Thermal Behavior, and Static Mechanical Properties of Sn-xZn Alloys Containing Mixed Trace Rare Earth Elements

Shih-Ying Chang, An-Bang Wu, Jun-Yen Lee, Yan-Hua Huang
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Briefs
J. Eng. Mater. Technol. April 2020, 142(2): 024502.
Paper No: MATS-19-1010
DOI: https://doi.org/10.1115/1.4045433
Published Online: December 5, 2019
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Topics: Alloys, Mechanical properties, Tin, Temperature, Tensile strength
Journal Articles

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Shugo Miyake, Kohei Ohtani, Shozo Inoue, Takahiro Namazu
Journal: Journal of Engineering Materials and Technology
Article Type: Research-Article
J. Eng. Mater. Technol. January 2016, 138(1): 011006.
Paper No: MATS-15-1128
DOI: https://doi.org/10.1115/1.4032020
Published Online: December 8, 2015
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Topics: Bonding, Fracture (Materials), Fracture (Process), Fracture toughness, Pressure, Reliability, Solder joints, Solders, Stress, Vacuum
Journal Articles

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. January 2008, 130(1): 011001.
DOI: https://doi.org/10.1115/1.2806237
Published Online: December 20, 2007
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Topics: Crack propagation, Cycles, Failure, Fracture (Materials), Low cycle fatigue, Solders, Tin, Stress concentration, Stress, Finite element analysis
Journal Articles

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada, Hideo Nishimura
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. April 2006, 128(2): 142–150.
DOI: https://doi.org/10.1115/1.2172273
Published Online: May 11, 2005
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Topics: Creep, Fatigue, Solders, Tin, Waves
Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2003, 125(1): 81–88.
DOI: https://doi.org/10.1115/1.1525254
Published Online: December 31, 2002
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Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin
Journal Articles

Optimum Forming Loading Paths for Pb-Sn Superplastic Sheet Materials

Marwan K. Khraisheh, Hussein M. Zbib
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Papers
J. Eng. Mater. Technol. July 1999, 121(3): 341–345.
DOI: https://doi.org/10.1115/1.2812384
Published Online: July 1, 1999
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Topics: Sheet materials, Superplasticity, Tin, Pressure, Deformation, Failure, Hardening
Journal Articles

An Investigation of Yield Potentials In Superplastic Deformation

Marwan K. Khraisheh
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2000, 122(1): 93–97.
DOI: https://doi.org/10.1115/1.482771
Published Online: May 14, 1999
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Topics: Alloys, Anisotropy, Deformation, Superplasticity, Tension, Torsion, Tin, Stress, Flow (Dynamics)
Journal Articles

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

A. F. Skipor, S. V. Harren, J. Botsis
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Papers
J. Eng. Mater. Technol. January 1996, 118(1): 1–11.
DOI: https://doi.org/10.1115/1.2805929
Published Online: January 1, 1996
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Topics: Solders, Tin, Stress, Creep, Temperature, Electronic packaging, Finite element analysis, Temperature effects, Tension, Viscoplasticity
Journal Articles

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

E. P. Busso, M. Kitano, T. Kumazawa
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. July 1992, 114(3): 331–337.
DOI: https://doi.org/10.1115/1.2904181
Published Online: July 1, 1992
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Topics: Constitutive equations, Solders, Deformation, Hardening, Steady state, Stress, Continuum mechanics, Creep, Finite element analysis, Lead alloys
Journal Articles

Progress in the Design of an Improved High-Temperature 1 Percent CrMoV Rotor Steel

R. L. Bodnar, J. R. Michael, S. S. Hansen, R. I. Jaffee
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. January 1990, 112(1): 99–115.
DOI: https://doi.org/10.1115/1.2903194
Published Online: January 1, 1990
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Topics: Design, High temperature, Rotors, Steel, Creep, Temperature, Rupture, Fracture toughness, Ductility, Tensile strength
Journal Articles

The Effects of Composition and Microstructure on Temper Embrittlement in 2 1/4 Cr-1 Mo Steel

J. C. Murza, C. J. McMahon, Jr.
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. October 1980, 102(4): 369–375.
DOI: https://doi.org/10.1115/1.3224826
Published Online: October 1, 1980
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Topics: Embrittlement, Steel, Augers, Cooling, Grain size, Martensitic steel, Phase transition temperature, Scanning electron microscopy, Tin
Journal Articles

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

R. W. Rohde, J. C. Swearengen
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. April 1980, 102(2): 207–214.
DOI: https://doi.org/10.1115/1.3224799
Published Online: April 1, 1980
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Topics: Alloys, Deformation, Modeling, Relaxation (Physics), Solders, Stress, Tin, Aluminum, Dislocations, Stainless steel
Journal Articles

Stress Relaxation in the Sn-Pb Eutectic Alloy

G. S. Murty, U. P. Singh, N. G. R. Iyengar
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Briefs
J. Eng. Mater. Technol. April 1975, 97(2): 187–188.
DOI: https://doi.org/10.1115/1.3443280
Published Online: April 1, 1975
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Topics: Eutectic alloys, Relaxation (Physics), Stress, Tin