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Journal Articles

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Shugo Miyake, Kohei Ohtani, Shozo Inoue, Takahiro Namazu

J. Eng. Mater. Technol. January 2016, 138(1): 011006.

Paper No: MATS-15-1128

DOI: https://doi.org/10.1115/1.4032020

Published Online: December 8, 2015

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Topics: Bonding, Fracture (Materials), Fracture (Process), Fracture toughness, Pressure, Reliability, Solder joints, Solders, Stress, Vacuum

Journal Articles

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Takahiro Namazu, Kohei Ohtani, Shozo Inoue, Shugo Miyake

J. Eng. Mater. Technol. July 2015, 137(3): 031011.

Paper No: MATS-14-1250

DOI: https://doi.org/10.1115/1.4030413

Published Online: July 1, 2015

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Topics: Fracture (Materials), Fracture (Process), Metals, Solder joints, Solders, Stress, Bonding, Pressure

Journal Articles

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada

J. Eng. Mater. Technol. January 2008, 130(1): 011001.

DOI: https://doi.org/10.1115/1.2806237

Published Online: December 20, 2007

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Topics: Crack propagation, Cycles, Failure, Fracture (Materials), Low cycle fatigue, Solders, Tin, Stress concentration, Stress, Finite element analysis

Journal Articles

Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation

Dong-Jin Shim, S. Mark Spearing, Qingda Yang

J. Eng. Mater. Technol. January 2007, 129(1): 19–28.

DOI: https://doi.org/10.1115/1.2400257

Published Online: December 6, 2005

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Topics: Fracture (Materials), Piezoelectric ceramics, Shear (Mechanics), Solder joints, Solders, Shear deformation, Plates (structures)

Journal Articles

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada, Hideo Nishimura

J. Eng. Mater. Technol. April 2006, 128(2): 142–150.

DOI: https://doi.org/10.1115/1.2172273

Published Online: May 11, 2005

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Topics: Creep, Fatigue, Solders, Tin, Waves

Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang

J. Eng. Mater. Technol. January 2003, 125(1): 81–88.

DOI: https://doi.org/10.1115/1.1525254

Published Online: December 31, 2002

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Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin

Journal Articles

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

A. F. Skipor, S. V. Harren, J. Botsis

J. Eng. Mater. Technol. January 1996, 118(1): 1–11.

DOI: https://doi.org/10.1115/1.2805929

Published Online: January 1, 1996

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Topics: Solders, Tin, Stress, Creep, Temperature, Electronic packaging, Finite element analysis, Temperature effects, Tension, Viscoplasticity

Journal Articles

Quantitative Comparison Between Precision Closed-Die Forging-Force Data and Computer Simulations

J. N. Majerus, K. P. Jen, H. Gong

J. Eng. Mater. Technol. October 1992, 114(4): 465–471.

DOI: https://doi.org/10.1115/1.2904200

Published Online: October 1, 1992

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Topics: Computer simulation, Forging, Engineering simulation, Simulation, Computers, Displacement, Finite element methods, Finite element model, Elasticity, Forgings (Products)

Journal Articles

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

E. P. Busso, M. Kitano, T. Kumazawa

J. Eng. Mater. Technol. July 1992, 114(3): 331–337.

DOI: https://doi.org/10.1115/1.2904181

Published Online: July 1, 1992

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Topics: Constitutive equations, Solders, Deformation, Hardening, Steady state, Stress, Continuum mechanics, Creep, Finite element analysis, Lead alloys

Journal Articles

Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders

K. P. Jen, J. N. Majerus

J. Eng. Mater. Technol. October 1991, 113(4): 475–484.

DOI: https://doi.org/10.1115/1.2904128

Published Online: October 1, 1991

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Topics: Solders, Stress, Errors, Compression, Elasticity, Eutectic alloys, Event history analysis, Mechanical properties, Microhardness, Printed circuit boards

Journal Articles

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

R. W. Rohde, J. C. Swearengen

J. Eng. Mater. Technol. April 1980, 102(2): 207–214.

DOI: https://doi.org/10.1115/1.3224799

Published Online: April 1, 1980

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Topics: Alloys, Deformation, Modeling, Relaxation (Physics), Solders, Stress, Tin, Aluminum, Dislocations, Stainless steel

Journal citation

NARROW

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

Quantitative Comparison Between Precision Closed-Die Forging-Force Data and Computer Simulations

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

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