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Keywords: stress-strain relations
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
... CTE or nonconsidering residual strain, especially for temperature above T g . 02 12 2010 30 09 2011 09 12 2011 09 12 2011 electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity thermomechanical analysis...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
... solders stress-strain relations Solder alloys are extensively used in electronic packaging because of their favorable wetting properties and low melting temperature. However, most electronic packaging solder alloys operate at thermally activated condition at room temperature, due to their low...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... A is as high as 38%. 26 11 2008 02 12 2009 25 06 2010 25 06 2010 chip scale packaging cracks elastoplasticity finite element analysis fracture mechanics solders stress-strain relations thermal analysis Weibull distribution The problem of solder joint fatigue...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
... and tangential vectors of the interface in Fig. 12 , and k n , k t , k θ , and k t θ are the stiffness coefficients of the interface. Combining Eqs. 5 , 6 with Eqs. 7 , 8 , the constitutive stress-strain relations of the continuum are obtained as 9 ( σ t...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... ,” Mater. Res. Soc. Symp. Proc. 0272-9172 , 445 , pp. 307 – 312 . 14 03 2006 23 06 2006 fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
.... 01 November 2002 15 12 2003 soldering alloys fatigue chip scale packaging deformation thermal shock stress-strain relations viscoplasticity interface phenomena failure analysis Solder joint fatigue failure was one of the common failure mechanisms occurring in electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
Published Online: July 26, 2002
...-strain relations finite element analysis thermal expansion creep displacement measurement A powerful optomechanics technique such as moire´ interferometry has been used for many years to measure whole field displacements in the electronic packaging industry to calibrate and compare numerical...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
Published Online: October 10, 2000
... reliability failure analysis stress analysis finite element analysis Rayleigh-Ritz methods viscoplasticity stress-strain relations 10 October 2000 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
Published Online: September 1, 2000
... and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: B. Michel. thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
Published Online: June 28, 2000
... fibres optical fibres bending stress-strain relations Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 22, 1999; revised manuscript received June 28, 2000. Associate Editor: B...
Journal Articles