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Keywords: stress-strain relations
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
... CTE or nonconsidering residual strain, especially for temperature above T g . 02 12 2010 30 09 2011 09 12 2011 09 12 2011 electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity thermomechanical analysis...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
... rate data. creep electronics packaging solders stress-strain relations Solder alloys are extensively used in electronic packaging because of their favorable wetting properties and low melting temperature. However, most electronic packaging solder alloys operate at thermally activated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... using the developed computational procedure 26 11 2008 02 12 2009 25 06 2010 25 06 2010 chip scale packaging cracks elastoplasticity finite element analysis fracture mechanics solders stress-strain relations thermal analysis Weibull distribution...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
... and tangential vectors of the interface in Fig. 12 , and k n , k t , k θ , and k t θ are the stiffness coefficients of the interface. Combining Eqs. 5 , 6 with Eqs. 7 , 8 , the constitutive stress-strain relations of the continuum are obtained as 9 ( σ t...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
Published Online: January 31, 2008
... silver alloys stress-strain relations tin alloys As technology progresses, more consumer and military products are making use of electronics to augment or enhance performance, and thus the use of electronics is increasing worldwide. Concurrently, there is an increased awareness to limit the use...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin alloys 2007 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
.... 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36%Pb–2%Ag alloy area array package chips CSP ball grid array printed wiring boards An area...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
.... 01 November 2002 15 12 2003 Except for the above consideration, some other simplifications and assumptions were also used to enable the analysis in this study. They were: soldering alloys fatigue chip scale packaging deformation thermal shock stress-strain relations...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... reliability chip scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis 03 April 2001 26 07 2002 Contributed by the Electronic and Photonic Packaging...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
Published Online: July 26, 2002
... (packaging) integrated circuit packaging soldering integrated circuit reliability fatigue stress-strain relations finite element analysis thermal expansion creep displacement measurement A powerful optomechanics technique such as moire´ interferometry has been used for many years to measure...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
Published Online: October 10, 2000
... reliability failure analysis stress analysis finite element analysis Rayleigh-Ritz methods viscoplasticity stress-strain relations 10 October 2000 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
Published Online: September 1, 2000
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: B. Michel. thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed by bonding...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
Published Online: June 28, 2000
... fibres bending stress-strain relations Two-point bending is one of the simplest technique for strength measurements of optical glass fibers. In the technique, the bending strains are applied by constraining fibers between two face-plates as shown in Fig. 1 or by inserting fibers into a glass...
Journal Articles
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
Published Online: March 1, 2000
...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...