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Keywords: silver alloys
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
.... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... and Sn-3.5Ag Solders ,” The Society of Materials Science, Japan, p. 102. 13 12 2009 14 09 2010 03 12 2010 03 12 2010 copper alloys creep fatigue testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... constitutive model time-independent strain time-dependent strain cyclic plasticity stress relaxation compressive strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
.../base metal interface. The solder reacts with a small amount of the base metal and wets the metal by intermetallic compound formation ( 1 2 3 ). wetting solders contact angle surface roughness activation energy eutectic alloys interface phenomena lead alloys silver alloys solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
... alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper was published in Proceedings of 56th Electronic Components and Technology Conference, San...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... , Tokyo , p. 25 . Lemaitre , J. , and Chaboche , J. -L. , 1990 , Mechanics of Solid Materials , Cambridge University Press , Cambridge, UK , p. 106 . 09 05 2008 26 11 2008 27 03 2009 copper alloys creep deformation elastoplasticity silver alloys solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis 29 04 2007 19 02 2008 18 02 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... 2.9–3.7 73 712 2.8 ± 0.7 2.3–3.4 62 1156 3.1 ± 0.8 2.4–3.8 69 25 09 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
... ; ( b ) linewidth of 100 μ m . 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
Published Online: July 29, 2008
... study ( 2 ). 12 05 2007 17 01 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
... 2007 31 01 2008 copper alloys flip-chip devices printed circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect the service reliability of a solder joint ( 1 ). Solder microstructure, soldering defects, cyclic temperature range...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... were examined, correlated, and discussed. flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip...