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Keywords: microstructure evolution
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
Published Online: December 9, 2022
... , “
Microstructures Evolution and Growth Kinetics of Intermetallic Compounds in Cu/Sn/Cu System During Ultrasonic Soldering Process ,” Soldering Surf. Mount Technol. ,
34 ( 2 ), pp. 79 – 87 . 10.1108/SSMT-06-2021-0034 [11]
Lin ,
K.
,
Ling ,
H.
,
Hu ,
A.
,
Wu ,
Y.
,
Gao ,
L...
