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Keywords: lead-free solder
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
.... 27 11 2017 07 02 2019 lead-free solder hysteresis thermal cycling damage microstructure Electronic equipment for aerospace and military applications can encounter a wide range of environmental stresses mainly due to thermomechanical loadings (temperature variations...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
Published Online: July 18, 2012
.... , and Wang , S. L. , 2003 , “ Fatigue Crack Growth Behavior of Sn–Pb and Sn-Based Lead-Free Solders ,” Eng. Fract. Mech. , 70 , pp. 2187 – 2197 . 10.1016/S0013-7944(02)00252-7 [9] Pringle , Raghavan , and Malatkar , 2007 , “ Solder Joint Reliability of BGA Package Under End-User Handling...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031003.
Published Online: July 18, 2012
... to predict the interface fracture strains for the case of a two-level strain rate loading based on the data of each respective single-level strain test. The prediction was reasonable when compared to the experimental data with an average absolute error of 10%. lead-free solder interface failure...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
... were investigated using the split Hopkinson tensile bar experimental technique. Stress-strain curves of the three solders were obtained, and microstructure and fractography of the specimens before and after the tests were examined and presented. The experimental results show that the lead-free solders...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... values) clearly suggests that the Sn–3.8Ag–0.7Cu solder alloy accumulates fatigue damage at a less rapid rate compared to the eutectic Sn–Pb composition for a given inelastic strain value. While this may also hint that lead-free solder joints will always have longer times to failure (everything else...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
Published Online: January 31, 2008
...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
... Model for Lead-Free Solder ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.2160514 , 128 ( 1 ), pp. 71 – 81 . Pierce , D. M. , Sheppard , S. D. , Fossum , A. F. , Vianco , P. T. , and Neilsen , M. K. , 2006 , “ Development of the Damage State Variable for a Unified...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
... out to investigate the dissolution kinetics of the electrolytic Ni and electroless NiP metallization during prolonged reflow for the Sn3.5Ag lead-free solder. The reaction kinetics of the solder joints was also investigated. 05 08 2003 22 12 2004 ball grid arrays reflow...