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Keywords: integrated circuit reliability
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Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13 ° C utilizing a multidimensional configured thermoelectric will be presented. 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 ball grid arrays delamination finite element analysis flip-chip devices integrated circuit reliability shrinkage...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
Published Online: March 4, 2010
... been appreciated by some research groups in WCSP solder joint reliability study ( 10 11 ). finite element analysis integrated circuit reliability solders wafer level packaging 2010 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
... 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman spectroscopy thermal resistance thermoreflectance Different methods for temperature measurement on the scale of modern electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... underfill versus viscoelastic underfill) 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
Published Online: April 9, 2007
... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
... packaging integrated circuit interconnections integrated circuit reliability printed circuits In prior generations of automotive electronics based on surface mount technology and laminated substrates, packaging of microprocessor and application-specific integrated circuit (ASIC) chips...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
Published Online: October 27, 2006
.... Results after the constant humidity test 11 01 2006 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability The primary drivers in the electronics industry...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
Published Online: June 3, 2005
... conducted by: Y. C. Chan. 13 January 2004 23 June 2004 03 06 2005 silicon compounds flip-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion While flip chip...