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Keywords: integrated circuit interconnections
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... 09 2011 30 09 2011 cooling electronics packaging integrated circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
... 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... integrated circuit interconnections numerical analysis printed circuits solders halogen free lead free solder alloy intermetallic characteristics joint strength The environmentally friendly green product is an irreversible trend for electronic industries, following the shift toward Pb...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
.../1.1669118 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
Published Online: November 12, 2009
... in package geometries. integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging industry primarily relies on the tried and trusted technique of imposing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
... vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations 29 10 2007 05 12 2008 25 02 2009 Local 2D model for resistor component L C R component on the FEA...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... simulations. A general fatigue life prediction methodology is next described in detail. Finally, this methodology is tested and verified against the empirical data. ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... finite element analysis high-speed techniques image sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
Published Online: July 29, 2008
... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
..., the interconnect behavior is a key issue in the long-term performance of the whole system. interconnect interface interferometer micropolar theory ball grid arrays integrated circuit interconnections stress-strain relations thermal analysis 16 02 2007 07 09 2007 15 05 2008...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
.... The approach along with the numerical procedures developed for the investigation can be a practical tool for realizing better device reliability and thus high manufacturing yield. 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
Published Online: February 12, 2008
... 15 08 2007 12 02 2008 ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections The increased proliferation of embedded and mobile devices has led to a sharp rise in the demand...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
Published Online: April 9, 2007
... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
... thermal cycles (e.g., 2000 cycles with no failure or 2500 cycles with less than 1% failure rate). automotive electronics ball grid arrays chip scale packaging integrated circuit interconnections integrated circuit reliability printed circuits 29 12 2004 07 03...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... . flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...