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Keywords: finite element analysis
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
Published Online: June 23, 2023
... for PID Controller Parameters Tuning: Review, Approaches and Open Problems ,” Heliyon , 8 ( 5 ), p. e09399 . 10.1016/j.heliyon.2022.e09399 [18] Moaveni, S., 2011 , Finite Element Analysis—Theory and Application With ANSYS , Pearson Education Limited , London, UK . [19] Systemes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
Published Online: November 22, 2021
... structure through manufacturing. The reliability of the leadless package structure after silver paste sintering was verified by finite element analysis, and the results showed that the thermal stress caused by high and low-temperature cycles in the leadless package is minimal and does not affect...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011001.
Paper No: EP-20-1071
Published Online: August 6, 2021
.... A previous successful assembly achieved an extra-thin chip scaled down to 10  μ m thin mounted to a silicon wafer; finite element analysis (FEA) is used to determine the related stress-induced failure mechanism of μ -joints [ 20 ]. Nevertheless, the creep-fatigue effect of μ -joints combined with increased...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
Published Online: March 9, 2020
... flexible electronics wearable smart shirt serpentine conductor mechanical evaluation finite element analysis The transition from rigid to flexible electronic devices in the recent years has significantly expanded the electronic device applications into wearable electronics, such as smart...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
Published Online: April 10, 2019
.... In the models of straight and barrel interconnects as the typical solder bumps in modern flip-chip technology, the critical current density is predicted through calculating electrical potential by proposed formulation and simulation based on the finite element analysis (FEA). The critical current density...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
Published Online: October 30, 2012
... that the thermal performance is most sensitive to the slot-depth compared to any other parameter. pin fin finite element analysis orthotropic material composite material heat sink electronic cooling The increasing market demand for smaller, lighter, and faster machines and electronics have...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031007.
Published Online: July 18, 2012
..., it is important to take the current bending effect into consideration and control the particle diameter and the bonding force properly. anisotropic conductive adhesive bulk resistance potential distribution finite element analysis The ACA is extensively used in the electronic packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... at micrometer level has not been possible using conventional techniques. In the present study, an efficient and accurate multi-level thermal modeling and analysis technique has been developed. The technique combines finite element analysis sub-modeling and a superposition method for more efficient modeling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
... experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested. 29 06 2010 19 10 2011 19 12 2011 19 12 2011 electronics packaging finite element analysis hardening semiconductor...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
Published Online: December 9, 2011
... 2010 13 04 2011 09 12 2011 09 12 2011 assembling electron device manufacture electronic products finite element analysis reliability transient response vibrations Designers have long realized the benefits of effective modeling and simulation during the design cycle...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
Published Online: December 9, 2011
... of the accelerometer, due to drop loading 12 03 2010 13 04 2011 09 12 2011 09 12 2011 assembling failure analysis finite element analysis printed circuit design transient response vibrations Portable electronic devices are frequently subjected to unintentional drops...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
Published Online: December 9, 2011
... ) the half-GPD model ( μ m) The Von Mises stress contour plot of ( a ) the octant model; and ( b ) the half-GPD model (MPa) 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... . 10.1007/BF02665483 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds fracture energy release rate cohesive zone model Solder joints provide electric connections and mechanical supports between the electronic component...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
Published Online: March 9, 2011
... structures, the obtained results seemed to be consistent and very promising for reaching the goal of a more complete and friendly tool for the analysis of the power electronic devices’ packaging systems. The comparison with the finite element analysis aimed at validating the THESIS results showed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041011.
Published Online: December 8, 2010
... steps of damage propagation. Elements around the joint that are killed as a result of damage propagation and do not accumulate any creep work 17 03 2010 08 07 2010 08 12 2010 08 12 2010 fatigue cracks finite element analysis solders viscoplasticity Low cycle...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... properties, fillet height, and silicon die thickness on the interface delamination between epoxy molding compound and silicon die during a lead-free solder reflow process based on the modified virtual crack closure method. Based on finite element analysis and experiment study, it can be concluded...