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Keywords: fatigue prediction
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
... deemed most likely to fail and the surrounding package layers) to facilitate fatigue prediction. Model validation was based on the thermal mechanical fatigue of plastic BGA solder joints (250–4000 thermal cycles, − 55 ° C to 125 ° C , and 10 ° C ∕ min ). Metallographic cross sections were used...