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Keywords: copper alloys
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction. 13 12 2009 14 09 2010 03 12 2010 03 12 2010 copper alloys creep fatigue...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
Published Online: September 9, 2010
... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys So far, flip chip assembly is exempt from the requirement...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method. copper alloys creep deformation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique. 05 01 2007 20 08 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
... location of failure was at the ( Au , Ni ) Sn 4 /solder interface on the chip side, and for the solder joints on bare pads and pads with solder mask, the possible failure location was in the bulk solder. 05 01 2007 12 07 2007 31 01 2008 copper alloys flip-chip devices printed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... as the loading frequency is reduced. 14 03 2006 23 06 2006 fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys are widely used in solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling analysis Electromigration is responsible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...