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Keywords: aging
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
Published Online: December 9, 2022
...Gangli Yang; Xiaoyan Li; Xu Han; Hu Zhang; Linjie Wen; Shanshan Li The paper focused on the changes in microstructure and mechanical properties of the full Cu 41 Sn 11 solder joint (Cu/Cu 41 Sn 11 /Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn...
