1-1 of 1
Keywords: aging
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
Published Online: December 9, 2022
...Gangli Yang; Xiaoyan Li; Xu Han; Hu Zhang; Linjie Wen; Shanshan Li The paper focused on the changes in microstructure and mechanical properties of the full Cu 41 Sn 11 solder joint (Cu/Cu 41 Sn 11 /Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn...