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Keywords: Moiré interferometry
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... ball grid arrays integrated circuit packaging durability fatigue testing fatigue cracks solders deformation global-local equivalent model submodel fatigue crack initiation HASMAP Moiré interferometry Commercial-off-the-shelf (COTS) electronics are being utilized...