1-1 of 1
Keywords: HASMAP
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... ball grid arrays integrated circuit packaging durability fatigue testing fatigue cracks solders deformation global-local equivalent model submodel fatigue crack initiation HASMAP Moiré interferometry Commercial-off-the-shelf (COTS) electronics are being utilized...