Stresses in a Thin Piezoelectric Element Bonded to a Half-Space

[+] Author and Article Information
Wolfgang E. Seemann

Department of Applied Mechanics, Darmstadt University of Technology, Darmstadt, Germany

Appl. Mech. Rev 50(11S), S204-S209 (Nov 01, 1997) doi:10.1115/1.3101836 History: Online April 20, 2009


In this paper, a thin piezoceramic element is considered which is bonded to an elastic or a rigid half-space. Such a model may be an approximation of the interaction between piezoceramic elements and elastic structures like beams and plates. For an elastic half-space, the determination of the shear stress in the bonding layer leads to a singular integral equation. A half-space which is very stiff may be modeled as a rigid substrate. For this case, displacement functions are introduced. Hamilton’s principle for electromechanical systems allows the use of Lagrange multipliers to incorporate the condition of a stress free upper surface of the piezoceramic element. The stresses in the bonding layer and in the piezoceramic element are estimated by this method and compared with Finite Element results. Though the singularity near the ends of the piezoceramic element cannot be modeled by both methods, stress concentrations can clearly be seen for the shear stress as well as for the normal stress. As infinite stresses due to the singularity do not occur in reality, the results allow an estimation of the bonding stresses except in the near vicinity of the edges. The knowledge of these stresses is important to prevent failure due to delamination.

Copyright © 1997 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In