The high temperature reliability of flex-based Cu/tiecoat/polyimide structures was evaluated through finite element simulation and experimental approach. This study is part of an effort to characterize and optimize polyimide flex as a substrate material for electronics packages rated to greater than 204°C. The peel strength of several common adhesion metals (Ti, Cr, Ni, Cu) on Kapton E was quantified at room temperature and after high temperature storage in inert and highly oxidizing environments. These results were used in tandem with thermal-mechanical simulations to characterize the behavior of several tiecoat materials. Experimental results showed diminished peel strengths of both the Ti and Cr after a 100-hour 250°C heat treatment in air. However when annealed in an inert N2 environment at 250°C for 100 hours, Cr, Ni, and Ti retained their as-sputtered peel strength. Ni and Cu exhibited lower mechanical stresses in the simulation; however, their relatively low reactivity limits their adhesion strength at the interface in oxidizing environments. To further understand the origin of the thermal-mechanical stress, the effect of mismatched CTE was compared to mismatched elastic modulus. Both properties were found to contribute to stress generation; however elastic modulus mismatches had a much greater influence on the overall magnitude of the stress. Through experimentation and FEA analysis this study aims to develop a flexed-based high temperature packaging solution and to shed light onto high temperature tiecoat/polyimide interactions.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging
Harry Schoeller,
Harry Schoeller
Binghamton University, Binghamton, NY
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Aaron Knobloch,
Aaron Knobloch
General Electric Global Research
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David Shaddock,
David Shaddock
General Electric Global Research
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Chris Kapusta,
Chris Kapusta
General Electric Global Research
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Kevin Durocher,
Kevin Durocher
General Electric Global Research
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Jungyun Cho
Jungyun Cho
Binghamton University, Binghamton, NY
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Harry Schoeller
Binghamton University, Binghamton, NY
Aaron Knobloch
General Electric Global Research
Hua Xia
General Electric Global Research
David Shaddock
General Electric Global Research
Chris Kapusta
General Electric Global Research
Kevin Durocher
General Electric Global Research
Jungyun Cho
Binghamton University, Binghamton, NY
Paper No:
IPACK2007-33419, pp. 517-524; 8 pages
Published Online:
January 8, 2010
Citation
Schoeller, H, Knobloch, A, Xia, H, Shaddock, D, Kapusta, C, Durocher, K, & Cho, J. "Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 517-524. ASME. https://doi.org/10.1115/IPACK2007-33419
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