The design, fabrication and testing of microfabricated thermal shear stress and temperature sensors are sensors is discussed. The devices are fabricated on a silicon substrate with a platinum sensor element 5 microns wide, 1000-Å thick and of varying length. The electrical leads are comprised of 5000-Å of gold deposited above the platinum sensor metal. The sensing area is isolated from the substrate by a thin membrane of silicon nitride covering a vacuum cavity. Test results are presented confirming the good thermal isolation of the sensor element from the substrate as well as the successful operation of the device.

This content is only available via PDF.
You do not currently have access to this content.