The failure behavior of adhesive joints under shock-wave loadings was investigated in a large scale shock tube facility for the first time. An overlapping specimen consisting of two parts, one circular patch and one supporting ring were bonded together in a specially designed jig. Sub-miniature semi-conductor strain gauges were attached on the specimen to monitor the transient strain on specific locations. A high speed camera was used to record the detachment of the patch from the ring. Image processing tool was used to track the position of the patch as a function of time. This information yield estimates of velocity, acceleration and kinetic energy of the patch. A finite element model was also created and the computation results were compared to the experimental values obtained.

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