A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.
- Materials Division, Nondestructive Evaluation Division, and Pressure Vessels and Piping Division
Modified Weibull Failure Theory for Size Effect Prediction of Brittle Thin Film
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Khandaker, M, Dhorje, M, & Ekwaro-Osire, S. "Modified Weibull Failure Theory for Size Effect Prediction of Brittle Thin Film." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Materials, Nondestructive Evaluation, and Pressure Vessels and Piping. Chicago, Illinois, USA. November 5–10, 2006. pp. 557-564. ASME. https://doi.org/10.1115/IMECE2006-14926
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