A critical aspect of the design of systems or experiments is a sensitivity analysis to determine the effects of the different variables. This is usually done by representing the response by a Taylor series and evaluating the first order derivatives at a nominal operating point. When there is uncertainty about the operating point, the common approach is the construction of a response surface and Monte Carlo sampling based on the probability distribution of these uncertain variables. When there are many variables it is important to restrict the analysis to those variables to which the response is most sensitive. This can be conveniently done using Global sensitivity, that both defines the most critical variables and also quantifies the effects of interacting variables. This can be a computationally expensive process and for complex models is generally prohibitively expensive. A solution is the use of Gaussian processes that allows one to create a response surface using easy-to-evaluate functions. This paper describes the use of these ideas for a heat transfer problem.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
The Determination of the Sensitivity of Heat Transfer Systems Using Global Sensitivity and Gaussian Processes
A. F. Emery,
A. F. Emery
University of Washington, Seattle, WA
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D. Bardot
D. Bardot
University of Washington, Seattle, WA
Search for other works by this author on:
A. F. Emery
University of Washington, Seattle, WA
D. Bardot
University of Washington, Seattle, WA
Paper No:
HT2005-72287, pp. 149-156; 8 pages
Published Online:
March 9, 2009
Citation
Emery, AF, & Bardot, D. "The Determination of the Sensitivity of Heat Transfer Systems Using Global Sensitivity and Gaussian Processes." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 149-156. ASME. https://doi.org/10.1115/HT2005-72287
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