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Review Articles

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

[+] Author and Article Information
Y. H. Yau1

Shijie Norman Hua

 Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia

1

Corresponding author.

Appl. Mech. Rev 64(2), 020803 (Dec 07, 2011) (17 pages) doi:10.1115/1.4005283 History: Received August 15, 2011; Revised October 07, 2011; Published December 07, 2011; Online December 07, 2011

This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

Copyright © 2011 by American Society of Mechanical Engineers
Topics: Drops
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References

Figures

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Figure 4

Gripper mechanism allows the test subject to be dropped in any precise orientation in an unconstrained manner, proposed by Shim [9]

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Figure 5

A Principal circuit of a dynamic resistance monitoring system proposed by Tee [22-25]

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Figure 6

Typical dynamic responses of PCB and solder joints subjected to board-level drop impact [22-25]

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Figure 7

Test setup at different impact orientations [32]

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Figure 8

Simple representation of a typical board level drop impact modeled as two spring-mass systems [20]

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Figure 10

Representation of a multilayer fill-warp PCB model with defined fiber orientation [49]

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Figure 11

Schematic illustration of the split Hopkinson pressure bar (SHPB) test [53]

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Figure 12

The various impact orientations that were investigated by Lim on cellular phones [59]

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Figure 1

Typical half-sine impact pulse with related formulas [1]

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Figure 2

Typical drop test apparatus and mounting scheme for PCB assembly based on JEDEC document JESD22-B111 [1]

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Figure 3

Illustration of a realistic, repeatable, and instrumentable drop testing method proposed by Buratynski [8]

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Figure 9

(a) Deformation of solder interconnect due to differential flexing between PCB and IC package (b) PCB modeled as a beam on elastic foundation model [20]

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Figure 13

Different PCB designs with point and edge contacts (Goo [70])

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Figure 14

Schematic illustration of the experimental setup adopted by Yu [72]

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Figure 15

Input-D method applied on a four-screw PCB assembly [74]

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Figure 16

Input-G method applied on a four-screw PCB assembly [76]

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Figure 17

Support excitation scheme proposed by Lai [83]

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Figure 18

Illustration of a global-local analysis methodology by Low [89]

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