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REVIEW ARTICLES

Recent developments and applications of invariant integrals

[+] Author and Article Information
Yi-Heng Chen

School of Civil Engineering and Mechanics, Xi’an Jiao-Tong University, Xi’an, 710049, P.R. China; yhchen2@mail.xjtu.edu.cn

Tian Jian Lu

Department of Engineering, University of Cambridge, Trumpington Street, Cambridge, CB2, 1PZ, UK; tjl21@cam.ac.uk

Appl. Mech. Rev 56(5), 515-552 (Aug 29, 2003) (38 pages) doi:10.1115/1.1582199 History: Online August 29, 2003
Copyright © 2003 by ASME
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References

Figures

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A semi-infinite interface crack in plane dissimilar bimaterials provided by Chen 63
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The distorted ring of elements provided by Matos et al. 61
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A dislocation of Burgers vector b lying on the interface between a pair of solids provided by Suo 196
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A crack of length l lies either on the interface or in one of the solids provided by Suo 196
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Many interacting cracks in an infinite plane elastic solid provided by Chen 1819
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Four regularly distributed cracks in an infinite plane elastic solid provided by Chen 1819
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Variable tendencies of the normalized M -integral against the loading angle ψ for the four regularly distributed cracks provided by Chen 1819
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Twenty randomly distributed cracks in an infinite plane elastic solid provided by Chen 1819
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Variable tendencies of the normalized M -integral against the loading angle ψ for the twenty cracks randomly distributed provided by Chen 1819
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An annular region outside of the nonlinear zone surrounding a crack tip provided by Hui and Ruina 35
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a) Single edge notched tension panel (SENT) and b) middle tension panel (MT) provided by Jeon and Im 37
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The contribution percentage of the HOSTs to the J -integral versus: a) the applied loading and b) the hardening exponents provided by Jeon and Im 37
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(a,b) A cross section in a 3D surface crack provided by Dobbs and Read 27 or Rigby and Aliabadi 31
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(a,b) A mode decomposition for a 3D mixed-mode crack provided by Kuo 234 or Kim et al. 231
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Stress-driven surface evolution in a heteroepitaxial thin film structure provided by Chiu and Gao 222, Gao 223, and Gao and Nix 224

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