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REVIEW ARTICLES

Quasi-Analytic Sensitivity Analysis of a Unified Viscoplastic Constitutive Model for a Solder Alloy

[+] Author and Article Information
Martin A. Eisenberg

Aerospace Engineering, Mechanics, and Engineering Science, University of Florida, Gainesville FL 32611-6250, and Engineering Mechanics, USAF Academy, CO 80840

Erhard Krempl, Luca Maciucescu

Mechanical Engineering, Aeronautical Engineering, and Mechanics, Rensselaer Polytechnic Institute, Troy NY 12180

Appl. Mech. Rev 50(11S), S44-S49 (Nov 01, 1997) doi:10.1115/1.3101849 History: Online April 20, 2009

Abstract

Unified constitutive models for the consistent description of inelastic thermomechanical response of engineering alloys to widely varying control conditions are strongly nonlinear; there are numerous constants to be determined; and successful use depends critically on expert professional judgment. These circumstances are not unlike those associated with the design of complex systems dependent on successful interaction of multidisciplinary teams. Introduced in this paper is a paradigm for design of constitutive models motivated by modern system design methodologies. Specifically, a quasi-analytic sensitivity analysis is applied to a special form of a viscoplasticity-based overstress model (VBO) for the uniaxial, isothermal, high-homologous temperature mechanical response of a solder alloy. Parameter sensitivity is demonstrated via linear algebraic equations. The technique is a critical first step to application of sophisticated techniques of multidisciplinary design optimization (MDO) to constitutive modeling.

Copyright © 1997 by American Society of Mechanical Engineers
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