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REVIEW ARTICLES: Part 5: Heat Transfer

Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond

[+] Author and Article Information
Wataru Nakayama

CALCE Electronic Packaging Research Center, University of Maryland, College Park MD 20742

Appl. Mech. Rev 49(10S), S167-S174 (Oct 01, 1996) doi:10.1115/1.3101968 History: Online April 20, 2009

Abstract

As electronic devices and equipment are finding their ways into diverse applications, their physical integrity becomes a matter of utmost concern. The thermal design criteria customarily assumed in many of previous heat transfer research programs have to be replaced by those on the thermomechanical load in compact systems. Attempts to find thermal and stress fields in critical parts of components, however, are beset by geometrical complexities and multiple length and time scales involved in transport processes in electronic equipment. Modeling of complex systems is the subject left for further rationalization. Also needed is the foresight about possible hardware morphologies taken by electronic equipment in the future. In view of possible saturation of 2D packaging technology, heat transfer studies for 3D packaging are worth being undertaken. Common to different scenarios of hardware development is the need to critically review the methodology and focuses of fundamental heat transfer research.

Copyright © 1996 by American Society of Mechanical Engineers
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