0
REVIEW ARTICLES

Thermally Induced Interfacial Stresses in Elongated Bimaterial Plates

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

Appl. Mech. Rev 42(11S), S253-S262 (Nov 01, 1989) doi:10.1115/1.3152398 History: Online June 03, 2009

Abstract

The interfacial thermally induced shearing and peeling stresses in elongated bimaterial plates are determined on the basis of an elementary beam (long-and-narrow plate) theory. The utilized approach enables one to satisfy the stress-free boundary conditions at the short edges within the framework of an elementary analytical model. The obtained formulas are simple, easy-to-use, and clearly indicate how material and geometric characteristics affect the magnitude and the distribution of stresses. The suggested approach is applicable, generally speaking, to any elongated bimaterial or adhesively bonded structure, subjected to thermal or external loading. As an example of an external loading, we examine bending of a bimaterial plate on a circular mandrel. Such a test vehicle is being currently regarded by many reliability engineers in the microelectronics industry as an attractive means to evaluate attachment materials in adhesively bonded and soldered assemblies.

Copyright © 1989 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In